| 摘要 |
<p>A semiconductor device (1) is provided with an insulating substrate (14), semiconductor elements (12, 13), and a cooler (20). The cooler (20) is provided with a heat dissipating substrate (21), fins (22), and a cooling case (23), which has the fins (22) housed therein, and which has a box-like shape having a bottom wall (23a) and side walls (23b). An inlet (23c) and an outlet (23d) of a cooling liquid are diagonally provided in a pair of side walls among the side walls (23b) of the cooling case (23), said pair of side walls being provided in the longitudinal direction of an assembly of the fins (22), and a diffusion wall (23g) toward the inlet (23c) is provided in the cooling case (23).</p> |
