| 摘要 |
Provided is a semiconductor module capable of shortening production takt, reducing production costs, and ensuring the reliability of a joining section. The semiconductor module (30) is equipped with: a metal substrate (31); an insulating layer (32) formed on the substrate (31); a plurality of wiring patterns (33a-33d) formed on the insulating layer (32); a bare-chip transistor (35) mounted on a wiring pattern (33a) using solder (34a); and copper connectors (36a, 36b) for joining the top of electrodes (S, G) of the bare-chip transistor (35) with the top of wiring patterns (33b, 33c) using solders (34b, 34c). The copper connectors (36a, 36b) are bridge-shaped, and have a narrow section (36ag) positioned near the joining surface (36af) with the electrodes (S, G), and a stress-relaxing section (36ak) positioned on the joining surface (36af) with the electrodes (S, G). |
