摘要 |
<p>MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ability to recover from condensation and / or saturation, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of ceramics, such as SiC, into such MEMS sensors and the integration of these MEMS sensors with silicon CMOS electronics, to effectively harness the benefits of ceramics and MEMS sensors including reference structures, electrical heaters, electrical interconnections, and multiple measurands. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.</p> |