| 摘要 |
<p>A method for manufacturing a circuit board, comprising the steps of: S1: dividing a flexible circuit board material (101) into a plurality of strip-shaped layout units (102) arranged in an array mode; S2: arranging at least one bending region (103) among the divided strip-shaped layout units (102), and laying out electronic components (104) at one side or at both sides of the bending region (103); S3: blanking the flexible circuit board material (101) laid out with the electronic components (104) into a plurality of flexible circuit boards (105) one by one according to the array mode; and S4: bending the blanked flexible circuit boards (105) one by one at the bending region (103) thereof. By adopting strip-shaped flexible circuit boards to perform strip-shaped layout in a flexible circuit board material, the utilization rate of the flexible circuit board material is high, the loss is small, and the cost for manufacturing a single flexible circuit board is low.</p> |
