发明名称 PAN BOTTOM TEMPERATURE SENSOR
摘要 The present invention relates to a pot bottom temperature sensor which comprises: a heat-sensitive head (1) having a heat collecting plate (3) at the top thereof, a heat-sensitive element (4) attached to the bottom surface of the heat collecting plate, and a cylindrical holder (5) fixed to the heat collecting plate; a supporting pipe (2); and a spring (6) elastically supporting the heat-sensitive head upwards against the supporting pipe. The heat-sensitive head capable of moving downwards against the elastic supporting force of the spring is supported by the supporting pipe while prevented from being rotated, and a part preventing the rotation of the heat-sensitive head is not exposed to the outside so that the appearance of the pot bottom temperature sensor can be improved. The holder (5) has an internal cylindrical part (7) installed at a lower side therein, fixed thereto, and externally fit to the supporting pipe (2). A convex part (22) formed at one of the internal cylindrical part (7) and the supporting pipe (2) is wedged into a concave part (73) formed at the other of the internal cylindrical part (7) and the supporting pipe (2) so that the rotation of the heat-sensitive head (1) can be prevented. In addition, the bottom of the internal cylindrical part (7) is positioned higher than the bottom of the holder (5).
申请公布号 KR101393220(B1) 申请公布日期 2014.05.08
申请号 KR20130008792 申请日期 2013.01.25
申请人 RINNAI CORPORATION;RINNAI KOREA CO., LTD. 发明人 OTSUBO SHINGA
分类号 F24C3/12;F23N5/00;G01K7/18 主分类号 F24C3/12
代理机构 代理人
主权项
地址