| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method capable of reducing deviation of laser irradiation position, when performing laser processing of a workpiece by applying a laser beam along the scheduled processing lines.SOLUTION: During a laser processing step for forming a modified layer 1c in a wafer 1 along scheduled dividing lines 3, the image of a modified layer 1c formed from the rear surface 1b side of the wafer 1 is picked up at a predetermine timing by means of a camera 22, and then positional deviation of the scheduled dividing lines 3 and the modified layer 1c is detected and a correction value is calculated. Irradiation position of a laser beam L is matched to the scheduled dividing lines 3 by adding the correction value to the irradiation position data of a laser beam L, thus suppressing positional shift of the modified layer 1c formed subsequently from the scheduled dividing lines 3. |
