| 摘要 |
<p>[Problem] To provide an adhesive sheet which has antistatic performance, has a low coefficient of static friction in the sheet surface due to bleedout of an antistatic agent and has high semiconductor processability. [Solution] The adhesive sheet according to the present invention comprises a substrate film and an adhesive layer which is provided on the substrate film, wherein the substrate film is composed of an energy ray curable composition being formed into a film and cured, the composition including an energy ray curable resin and an ion liquid having ethylenically unsaturated bonds.</p> |
