PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND ELECTRONIC DEVICE

摘要

A photosensitive resin composition containing: an alkali-soluble resin (A); a phenolic resin (B) that is obtained by reacting a phenolic compound expressed by general formula (1) and an aromatic aldehyde compound expressed by general formula (2) in the presence of an acid catalyst; and a photoacid generator (C). [Chemical formula 1] (In the formula: R1 represents an organic group selected from the group consisting of alkoxy groups and alkyl groups having 1-20 carbon atoms; and p is an integer of 1-3.) [Chemical formula 2] (In the formula: R2 represents hydrogen or an organic group selected from the group consisting of alkoxy groups, hydroxy groups, and alkyl groups having 1-20 carbon atoms; and q is an integer of 0-3.)