PHOTOSENSITIVE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive composition to be used for forming a pattern by ultraviolet exposure and development, having such properties that a formed pattern can be changed into a normally tapered pattern with excellent smoothness by heat treatment and that a coating film excellent in heat resistance and weather resistance can be formed.SOLUTION: The photosensitive composition comprises a photosensitive resin prepared by allowing an epoxy group-containing ethylenically unsaturated monomer (c) to react with a copolymer (I) which is prepared by radical polymerization of ethylenically unsaturated monomers (M) including 10 to 90 wt.% of an ethylenically unsaturated monomer (a) having no carboxyl group and having a formula weight of 70 to 120 and 10 to 70 wt.% of a carboxyl group-containing ethylenically unsaturated monomer (b). In the reaction, 0.2 to 0.9 mole of epoxy groups in the monomer (c) is made to react with 1 mole of carboxyl groups in the copolymer (I).