| 摘要 |
Provided are a retainer ring for polishing a wafer and a method of manufacturing the retainer ring, in which an outer circumferential surface of the wafer is retained during an operation of polishing a wafer by using a chemical mechanical polishing (CMP) method. In detail, a retainer ring may be manufactured at relatively low costs. In addition, a method of manufacturing a retainer ring for polishing a wafer, which may be produced at relatively low costs, may be provided. |
