| 摘要 |
PROBLEM TO BE SOLVED: To provide a flow channel member in which reliability for heat stress is improved, and provide a heat exchanger using the same and a semiconductor manufacturing device.SOLUTION: A flow channel member includes a lid part on which an object to be processed is placed, a bottom plate part, a plurality of side wall parts connected to the lid part and the bottom plate part, and a flow channel in which the fluid flows. At least one of the plurality of side wall parts is a first side wall part whose width becomes narrow from the bottom plate part to the lid part in a cross sectional view orthogonal to the direction in which the fluid flows, and heat stress generated in a connection part of the lid part and the side wall part can be reduced, thereby improving reliability of the flow channel member for the heat stress. |
