| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an optical proximity effect correction method in which optical proximity effect correction can be easily and approximately performed; a processing unit; a program; a production method of a mask; and a production method of a semiconductor device.SOLUTION: In an optical proximity effect correction method, an OPC processing object layout pattern is extracted from an OPC execution region in which a difference layout pattern is assumed an origin, rule base OPC processing is performed to an OPC processing object layout pattern to generate an after OPC layout pattern, a replacement object after OPC layout pattern and a before modification after OPC layout pattern are used, and OPC layout data of an after modification layout pattern are acquired. An OPC execution region is a region in which only a distance A is removed as that a difference layout pattern is assumed an origin, and a layout data extraction region is a region in which a distance C is removed as that a difference layout pattern is assumed an origin.</p> |
