| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor module capable of removing foreign matters adhered to a semiconductor chip and a mounting substrate before an imaging element on the mounting substrate is encapsulated by a module housing, and thereby, of preventing short-circuit and leakage between the imaging element and the mounting substrate, and further, of suppressing occurrence of black flaws (patterns) as shadows of the foreign matters on a display image to display a clear subject image.SOLUTION: In a method of manufacturing a semiconductor module, a semiconductor chip 3 took out by opening a packaging body is cleaned before a step S2 of die-bonding the semiconductor chip 3 on a mounting substrate. Thereafter, the semiconductor chip 3 is cleaned before a step S4 of connecting an electrode of the semiconductor chip 3 and a terminal of the mounting substrate by wire bonding. Further, the semiconductor chip 3 is cleaned before a step S5 of encapsulating the semiconductor chip 3. |
