| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible both-surface wiring board in which photosensitive dry film resist does not deform and no copper wiring pattern defect is caused.SOLUTION: A method of manufacturing a flexible wiring board includes, in order; (1) forming a through hole 3 in an insulation film 1; (2) forming a conductive layer 2 on both surfaces of the insulation film and a through hole wall surface by a dry plating method; (3) forming a base material, having a predetermined mask pattern 4 formed using photosensitive resist for wiring pattern formation, on the conductive layer; (4) forming a wiring pattern 5 by a semi-additive method on the conductive layer at a part exposed from a mask pattern by applying a voltage between an insoluble anode provided opposite the conductive layer and the conductive layer as a cathode while gripping width-directional ends except a mask pattern region with the base material where the mask pattern is formed set to have its width direction vertically; (5) removing the mask pattern; and (6) removing the conductive layer at the place where the mask pattern is removed. |
