发明名称 |
MAPPING DENSITY AND TEMPERATURE OF A CHIP, IN SITU |
摘要 |
A method and system to map density and temperature of a chip, in situ, is disclosed. The method includes measuring a propagation time that a mechanical propagation wave travels along at least one predefined path in a substrate. The method further includes calculating an average substrate density and temperature along the at least one predefined path as a function of the propagation time and distance. The method further includes determining a defect or unauthorized modification in the substrate based on the average substrate density being different than a baseline substrate density. |
申请公布号 |
US2014124878(A1) |
申请公布日期 |
2014.05.08 |
申请号 |
US201213669891 |
申请日期 |
2012.11.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CANN JEROME L.;VALLETT DAVID P. |
分类号 |
H01L29/84;G06F17/50 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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