| 摘要 |
Methods, systems, and apparatuses for semiconductor devices are provided herein. A semiconductor device includes an array of conductive pads for signals. One or more non-linear compliant springs may be present to route signals from the conductive pads to interconnect pads formed on the semiconductor device to attach bump interconnects. Each non-linear compliant spring may include one or more routing segments. The semiconductor device may be mounted to a circuit board by the bump interconnects. When the semiconductor device operates, heat may be generated by the semiconductor device, causing thermal expansion by the semiconductor device and the circuit board. The semiconductor device and circuit board may expand by different amounts due to differences in their thermal coefficients of expansion. The non-linear compliant springs provide for compliance between the conductive pads and bump interconnects to allow for the different rates of expansion. |
