发明名称 |
CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR |
摘要 |
A conductive interconnect includes an inorganic collar. The conductive interconnect includes a conductive support layer. The conductive interconnect also includes a conductive material on the conductive support layer. The conductive interconnect further includes an inorganic collar partially surrounding the conductive material. The inorganic collar is also disposed on sidewalls of the conductive support layer. |
申请公布号 |
US2014124877(A1) |
申请公布日期 |
2014.05.08 |
申请号 |
US201313764261 |
申请日期 |
2013.02.11 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
SUN YANGYANG;ZHAO LILY;HAN MICHAEL |
分类号 |
H01L29/43;H01L21/768;H01L23/498;H01L29/84 |
主分类号 |
H01L29/43 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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