| 摘要 |
The invention relates to a method of making through-substrate-vias in glass substrates. A first substrate (10) is provided on which a plurality of needles (11) protruding vertically from the substrate are made. A second substrate (14) made of glass is then provided. The substrates are located adjacent each other such that the needles on the first substrate face the second substrate. Heat is applied to a temperature where the glass softens, by heating the glass or the needle substrate or both. A force (F) is applied such that the needles on the first substrate penetrate into the glass to provide impressions in the glass. Finally, the first substrate is removed and material filling the impressions in the second substrate made of glass is provided. There is also provided a device, comprising a silicon substrate (100; 200). There is a cavity (102) in which a MEMS component (104) is accommodated, and a cap wafer (300) made of a material having a low dielectric constant, preferably glass. The cap wafer has through substrate vias of metal, and is bonded to the silicon substrate. |
