EPOXY RESIN AND MANUFACTURING METHOD THEREFOR

摘要

Provided is an epoxy resin that has a low chlorine content, a high heat tolerance, and low moisture absorbency and is suitable as a semiconductor sealant or an insulating material for electrical or electronics applications, e.g. in a printed circuit board. Said epoxy resin can be represented by general formula (1) (in which m represents a repetition count, the mean value of which satisfies the relation 0.1 < m < 10; n represents a repetition count, the mean value of which satisfies the relation 0 < n < 10; X and Y may be the same as or different from each other and each represent a group that can be represented by general formula (2), a naphthalene group, or a phenylene group that may have a C1-10 hydrocarbon group or a halogen atom as a substituent; and G represents a glycidyl group).