SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, SOLID STATE IMAGE PICKUP DEVICE AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor substrate which enables easy and successful electrical connection between semiconductor substrates while encapsulating a space between electrodes with a resin without using methods such as cutting and CMP (Chemical Mechanical Polishing).SOLUTION: A semiconductor substrate 1 of the present embodiment comprises: a substrate 10; an electrode array 20 which is provided on one surface of the substrate in a thickness direction and includes a plurality of electrodes 20a arranged two-dimensionally in planar view; and a resin layer 31 provided on the one surface, for encapsulating a circumference of the plurality of electrodes. The plurality of electrodes protrude on the resin layer by 5 percent and over of a self height and can be housed in the resin layer by compression in a height direction.