A curing agent composition for an epoxy compound including (a) at least one phenalkamine, and (b) at least one isocyanate; a curable composition including (I) at least one epoxy compound, (II) at least one phenalkamine, and (III) at least one isocyanate; and a thermoset prepared from the above curable composition.
申请公布号
WO2014067096(A1)
申请公布日期
2014.05.08
申请号
WO2012CN83844
申请日期
2012.10.31
申请人
DOW GLOBAL TECHNOLOGIES LLC;YAN, LEI;ZHANG, YI;ZHOU, WEI