| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase long-term connection reliability to improve electro-migration resistance in a semiconductor package.SOLUTION: An electrode pad of a semiconductor element 1 is connected with an electrode pad 20 on a substrate 21 with a solder ball. The solder ball comprises: a metal core part 11; and a solder part 10 which is disposed around the metal core part 11 and is lower than the core part 11 in rigidity and a melting point. The solder ball is connected with the semiconductor element 1 by reflow. Then, the semiconductor element 1 attached with the solder ball is ultrasonic-connected with the substrate 21, and the metal core part 11 is directly connected with the electrode pad 20 on the substrate 21 side, thereby connection with reduced thermal stress and reduced resistance can be attained.</p> |
