发明名称 COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method capable of mounting small and large two different size substrates and capable of integrating two different production lines of small and large size substrates.SOLUTION: When a substrate reception section 21 sets a gap between two substrate reception stages 21s to a first gap and receives two small size substrates 2, a left side substrate transfer unit 82a simultaneously transfers the two small size substrates 2 received by the substrate reception section 21 to a component mounting section 22. When a substrate reception section 21 sets a gap between two substrate reception stages 21s to a second gap larger than the first gap and receives two large size substrates 2, a left side substrate transfer unit 82a transfers the two large size substrates 2 received by the substrate reception section 21 to the component mounting section 22 one by one.</p>
申请公布号 JP2014081499(A) 申请公布日期 2014.05.08
申请号 JP20120229450 申请日期 2012.10.17
申请人 PANASONIC CORP 发明人 MIMURA YOSHIHIRO;HAMAZAKI KURAYASU
分类号 G09F9/00;G02F1/1345 主分类号 G09F9/00
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