| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent occurrence of peeling failures, when peeling a bonding sheet from a semiconductor wafer by using a peeling tape.SOLUTION: A bonding sheet S comprising a base material sheet BS and an adhesive layer AD, formed on one surface of the base material sheet BS, is pasted on a circuit surface of a semiconductor wafer W to protect the circuit surface. By having a split permitting cut C formed on the base material sheet BS or on the base material sheet BS and the adhesive layer AD, first and second split sheets S1 and S2 can be provided so as to be formed and provided so as to be peeled for each of the split sheets S1 and S2.</p> |
