发明名称 COOLING DEVICE FOR ELECTRONIC MACHINE
摘要 A cooling device for electronic equipment of the present invention comprises an air flow pipe through which external air passes; an air inlet pipe which receives the external air by being disposed to be perpendicular to the upper front side of the air flow pipe; a blower which receives the external air and is disposed on the air inlet pipe; an air outlet pipe which is disposed below the air flow pipe and discharges the air passing through the air flow pipe; and a radiator which absorbs heat generated in a circuit board by being disposed at the back side of the circuit board which has an electronic device at the front side, and is disposed on a path of the air flow pipe while being spaced apart from the blower. By the above configuration, the cooling device increases cooling efficiency, reduces noise, and maintains cooling by improving a cooling flow structure.
申请公布号 KR20140053597(A) 申请公布日期 2014.05.08
申请号 KR20120119723 申请日期 2012.10.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, WOOK JIN;KIM, SUNG TAE;LEE, YONG HO;PARK, YOUNG CHAL;SHIN, SE HOON
分类号 H05K7/20;F24F13/00 主分类号 H05K7/20
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