发明名称 |
COOLING DEVICE FOR ELECTRONIC MACHINE |
摘要 |
A cooling device for electronic equipment of the present invention comprises an air flow pipe through which external air passes; an air inlet pipe which receives the external air by being disposed to be perpendicular to the upper front side of the air flow pipe; a blower which receives the external air and is disposed on the air inlet pipe; an air outlet pipe which is disposed below the air flow pipe and discharges the air passing through the air flow pipe; and a radiator which absorbs heat generated in a circuit board by being disposed at the back side of the circuit board which has an electronic device at the front side, and is disposed on a path of the air flow pipe while being spaced apart from the blower. By the above configuration, the cooling device increases cooling efficiency, reduces noise, and maintains cooling by improving a cooling flow structure. |
申请公布号 |
KR20140053597(A) |
申请公布日期 |
2014.05.08 |
申请号 |
KR20120119723 |
申请日期 |
2012.10.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, WOOK JIN;KIM, SUNG TAE;LEE, YONG HO;PARK, YOUNG CHAL;SHIN, SE HOON |
分类号 |
H05K7/20;F24F13/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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