发明名称 |
THERMOSETTING POLYIMIDE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE |
摘要 |
To provide a thermosetting polyimide resin composition that can provide a cured product which generates a small amount of decomposition gas even when exposed to, for example, a high-temperature environment of about 250°C, and which exhibits high heat resistance, high durability, favorable flexibility, and favorable adhesive property; a cured product produced from the thermosetting polyimide resin composition; and an adhesive produced from the thermosetting polyimide resin composition. The thermosetting polyimide resin composition containing (a) a polyimide produced through reaction between a tetracarboxylic acid component containing a tetracarboxylic dianhydride and/or a tetracarboxylic acid, and a diamine; and (b) a maleimide composition containing at least one polymaleimide compound represented by any of formulas (4-1) to (4-3). |
申请公布号 |
EP2428535(A4) |
申请公布日期 |
2014.05.07 |
申请号 |
EP20100772185 |
申请日期 |
2010.05.06 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
BITO, TSUYOSHI;OISHI, JITSUO;KIHARA, SHUTA |
分类号 |
C08L79/08;C08G73/12;C08K5/3415;C09J179/08 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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