| 摘要 |
Disclosed is a phenolic resin mixture which is produced by subjecting a reaction product containing a by-product produced by the halomethylation of a biphenyl to the methylene cross-linking reaction with phenol. Also disclosed is an epoxy resin mixture produced by epoxidizing the phenolic resin mixture. Further disclosed is an epoxy resin composition containing the epoxy resin mixture. A cured product of the epoxy resin mixture or the epoxy resin composition containing the epoxy resin mixture has excellent flame retardancy, and has a storage modulus that is lower than those of conventional flame-retardant cured epoxy resin products by a value falling within a specific range at 250°C. Therefore, the epoxy resin mixture or the epoxy resin composition containing the epoxy resin mixture is useful as a semiconductor sealing material that is required to have high flame retardancy and excellent lead-free solder resistance. |
