Elastic wave device and method for manufacturing the same

摘要

Provided is an elastic wave device (101) in which first and second multilayer electrically conductive films (102,104) are provided on a piezoelectric substrate (2), the first multilayer electrically conductive film (102) forms an IDT electrode and a first wiring pattern (103), the second multilayer electrically conductive film (104) forms an electrode pad (9) to which a bump (32) is connected and a second wiring pattern (105), at least one contact portion (B) where the second wiring pattern (105) is overlapped on the first wiring pattern (103) so as to be electrically connected to each other is provided. A top electrically conductive film of the first multilayer electrically conductive film (102) is an Al-based electrically conductive film (104c), and a bottom electrically conductive film of the second multilayer electrically conductive film (104) is an Al-based electrically conductive film (104c). An interlayer electrically conductive film (106) is disposed between said bottom electrically conductive film (104c) of the second multilayer electrically conductive film and the top electrically conductive film (102a) of the first multilayer electrically conductive film in at least one contact portion (B) where the second wiring pattern(105) is overlapped on the first wiring pattern (103)