WAFER RETAININER RING WITH A FUNCTION OF PAD CONDITIONER AND METHOD FOR PRODUCING THE SAME

摘要

The present invention relates to a wafer retainer ring used in a chemical-mechanical polishing (CMP) process which is part of a semiconductor manufacturing process and, more specifically, to a water retainer ring with a pad conditioner function designed to uniformly condition a pad while preventing the separation of a wafer during a CMP process and a manufacturing method thereof.