发明名称
摘要 <p>A bonding material for a honeycomb structure comprises inorganic particles in which D90/D10 is from 10 to 500, D10 is 100 µm or less and D90 is 4 µm or more, and the D10 and D90 are the values of 10% diameter and 90% diameter from a smaller particle diameter side, respectively, in volume-based integrated fractions of a particle diameter distribution measurement by a laser diffraction/scattering method.</p>
申请公布号 JP5486305(B2) 申请公布日期 2014.05.07
申请号 JP20090524514 申请日期 2008.07.25
申请人 发明人
分类号 C04B37/00;B01D39/20;F01N3/021 主分类号 C04B37/00
代理机构 代理人
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