Device for and method of cutting with laser array

摘要

The apparatus (10) has a transport device (5) for transporting a web or arcuate shaped substrate in a transport plane (E) in a transport direction (T). A laser cutting device (1) is arranged above or below the transport plane for processing the substrate, where a machine control unit (6) drives the transport device and the laser cutting device. The laser cutting device includes a laser array (2) having individually controllable vertical cavity surface emitting lasers extending across the width of the substrate. An independent claim is also included for a method for cutting and perforating a web or arcuate shaped substrate.