| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing tape reasonably peeling a release layer from an intermediate layer and improving work efficiency when peeling them, the dicing tape being used for obtaining a semiconductor chip by dicing a semiconductor wafer. SOLUTION: The dicing tape 1 includes the intermediate layer 4, the release layer 2 disposed on one surface 4a side of the intermediate layer 4, and a dicing layer 5 laminated on the other surface of the intermediate layer 4, wherein the intermediate layer 4 has an adhesive portion 4B having stickiness in at least a portion of the region of the intermediate layer 4, the release layer 2 is pasted to the adhesive portion 4B of the intermediate layer 4, peeling force applied between the release layer 2 and the adhesive portion 4B of the intermediate layer 4 at 23°C is not more than 12 N/m, and the rigidity modulus of the dicing layer 5 at 23°C is not less than 17.5 N/25 mm in this dicing tape. COPYRIGHT: (C)2011,JPO&INPIT |
