发明名称
摘要 Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).
申请公布号 JP5486282(B2) 申请公布日期 2014.05.07
申请号 JP20090278210 申请日期 2009.12.08
申请人 发明人
分类号 B23K35/363;H05K3/34 主分类号 B23K35/363
代理机构 代理人
主权项
地址
您可能感兴趣的专利