| 摘要 |
PROBLEM TO BE SOLVED: To provide a firing apparatus of a ceramic substrate and a method for firing the ceramic substrate using the same, more particularly, to provide a firing apparatus of the ceramic substrate capable of performing smoothly binder removal of a large-scale ceramic substrate, and a method for firing the ceramic substrate using the ceramic substrate.SOLUTION: A firing apparatus of a ceramic substrate includes: a firing setter; unfired ceramic supporting columns which are arranged around the firing setter, and which are thicker than the firing setter; and a ceramic substrate arranged on the unfired ceramic supporting columns at a fixed interval with the firing setter. A method for firing the ceramic substrate using the same is also provided. Warpage of the substrate can be suppressed by firing under pressure a large-scale ceramic substrate by using ceramic supporting columns having a larger shrinkage than the ceramic substrate and a firing pressing plate. |
