A semiconductor nanoparticle assembly including semiconductor nanoparticles having a core/shell structure, and wherein the semiconductor nanoparticles are bonded by means of amide bonds.
申请公布号
EP2610322(A4)
申请公布日期
2014.05.07
申请号
EP20110819625
申请日期
2011.03.15
申请人
KONICA MINOLTA MEDICAL & GRAPHIC, INC.;TOHOKU UNIVERSITY
