发明名称 |
Semiconductor packages and methods of packaging semiconductor devices |
摘要 |
A device is disclosed. The device includes a carrier substrate having first and second major surfaces. The first surface includes a die region and contact pads and the second surface includes package contacts. The carrier substrate includes a patterned lead frame which defines a line level with conductive traces and a via level with via contacts. The patterned lead frame provides interconnections between the contact pads and package contacts. The carrier substrate further includes a dielectric layer isolating the conductive traces and via contacts. The device includes a die mounted on the die region of the first surface. |
申请公布号 |
US8716873(B2) |
申请公布日期 |
2014.05.06 |
申请号 |
US201113174923 |
申请日期 |
2011.07.01 |
申请人 |
WANG CHUEN KHIANG;SUTHIWONGSUNTHORN NATHAPONG;SAE LE KRIANGSAK;DIMAANO ANTONIO JR B;NG CATHERINE BEE LIANG;GAN RICHARD TE;ENG KIAN TENG;UNITED TEST AND ASSEMBLY CENTER LTD. |
发明人 |
WANG CHUEN KHIANG;SUTHIWONGSUNTHORN NATHAPONG;SAE LE KRIANGSAK;DIMAANO ANTONIO JR B;NG CATHERINE BEE LIANG;GAN RICHARD TE;ENG KIAN TENG |
分类号 |
H01L23/528;H01L23/498 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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