| 发明名称 |
Die including a groove extending from a via to an edge of the die |
| 摘要 |
Embodiments include but are not limited to apparatuses and systems including a die or a preform including at least one groove configured to extend from at least one via of the die to an edge of the die. Other embodiments may be described and claimed. |
| 申请公布号 |
US8718720(B1) |
申请公布日期 |
2014.05.06 |
| 申请号 |
US20100847477 |
申请日期 |
2010.07.30 |
| 申请人 |
LIU SHIXI LOUIS;MA WENLONG;CHAU FRANK HIN-FAI;LIN BARRY JIA-FU;TRIQUINT SEMICONDUCTOR, INC. |
发明人 |
LIU SHIXI LOUIS;MA WENLONG;CHAU FRANK HIN-FAI;LIN BARRY JIA-FU |
| 分类号 |
H04M1/00;H01L23/12;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H04M1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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