发明名称 |
Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding |
摘要 |
Embodiments of an interposer package structure are provided herein. Embodiments include a substrate having first and second opposing surfaces. An IC die electrically coupled to the first surface of the substrate. A plurality of contact members coupled to the first surface of the substrate. An interposer having a plurality of contact elements located on a first surface. Each conductive element coupled to a respective one of the plurality of contact members. The interposer is configured to facilitate wireless communication between the IC die and another device, heat spreading and electromagnetic interference shielding. |
申请公布号 |
US8718550(B2) |
申请公布日期 |
2014.05.06 |
申请号 |
US201113247543 |
申请日期 |
2011.09.28 |
申请人 |
ZHAO SAM ZIQUN;KHAN REZAUR RAHMAN;BROADCOM CORPORATION |
发明人 |
ZHAO SAM ZIQUN;KHAN REZAUR RAHMAN |
分类号 |
H04B5/00 |
主分类号 |
H04B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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