发明名称 |
Device with integrated power supply |
摘要 |
Semiconductor devices and methods for forming a semiconductor device are disclosed. The semiconductor device includes a die. The die includes a die substrate having first and second major surfaces. The semiconductor device includes a power module disposed below the second major surface of the die substrate. The power module is electrically coupled to the die through silicon via (TSV) contacts. |
申请公布号 |
US8716856(B2) |
申请公布日期 |
2014.05.06 |
申请号 |
US201213565748 |
申请日期 |
2012.08.02 |
申请人 |
TAN JUAN BOON;LIM YEOW KHENG;SIAH SOH YUN;LIU WEI;GONG SHUNQIANG;GLOBALFOUNDRIES SINGAPORE PTE. LTD. |
发明人 |
TAN JUAN BOON;LIM YEOW KHENG;SIAH SOH YUN;LIU WEI;GONG SHUNQIANG |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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