| 摘要 |
A honeycomb structure includes: a honeycomb structural portion having porous partition walls functioning as fluid passages and separating and forming a plurality of cells extending from one end face to the other end face. The partition walls and the outer peripheral wall contain silicon carbide particles as a framework and silicon as a binder for binding the silicon carbide particles. The honeycomb structure has a partition walls thickness of 50 to 200μm, a cell density of 40 to 150 cells/cm2, and an average particle diameter of the silicon carbide as a framework of 3 to 40μm. The honeycomb structural portion has a volume resistivity of 1 to 40Ωcm at 400° C., and the volume resistivity of the electrode portion at 400° C. is not more than 40% of the volume resistivity of the honeycomb structural portion at 400° C. |
