发明名称 Method and system for junction termination in GaN materials using conductivity modulation
摘要 A semiconductor structure includes a GaN substrate having a first surface and a second surface opposing the first surface. The GaN substrate is characterized by a first conductivity type and a first dopant concentration. The semiconductor structure also includes a first GaN epitaxial layer of the first conductivity type coupled to the second surface of the GaN substrate and a second GaN epitaxial layer of a second conductivity type coupled to the first GaN epitaxial layer. The second GaN epitaxial layer includes an active device region, a first junction termination region characterized by an implantation region having a first implantation profile, and a second junction termination region characterized by an implantation region having a second implantation profile.
申请公布号 US8716716(B2) 申请公布日期 2014.05.06
申请号 US201113334742 申请日期 2011.12.22
申请人 NIE HUI;EDWARDS ANDREW P.;DISNEY DONALD R.;BROWN RICHARD J.;KIZILYALLI ISIK C.;AVOGY, INC. 发明人 NIE HUI;EDWARDS ANDREW P.;DISNEY DONALD R.;BROWN RICHARD J.;KIZILYALLI ISIK C.
分类号 H01L21/335;H01L29/20 主分类号 H01L21/335
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