发明名称 Methods and apparatus to review defects using scanning electron microscope with multiple electron beam configurations
摘要 One embodiment relates to a method of reviewing defects using a scanning electron microscope (SEM). A defect location having a defect for review is selected, and the SEM is configured to be in a first imaging configuration. The selected defect location is imaged using the SEM to generate a first SEM image of the selected defect location. A determination is made as to whether the defect is visible or non-visible in the first SEM image. If the defect is non-visible in the first SEM image, then the SEM is configured to be into a second imaging configuration, the selected defect location is imaged using the SEM to generate a second SEM image of the selected defect location, and a further determination is made as to whether the defect is visible or non-visible in the second SEM image. Other embodiments, aspects and features are also disclosed.
申请公布号 US8716662(B1) 申请公布日期 2014.05.06
申请号 US201213549847 申请日期 2012.07.16
申请人 MACDONALD PAUL;XIAO HONG;KLA-TENCOR CORPORATION 发明人 MACDONALD PAUL;XIAO HONG
分类号 H01J37/28 主分类号 H01J37/28
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