发明名称 |
Integrated circuit packaging system with encapsulation and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base integrated circuit on the base substrate; forming a base encapsulation, having a base encapsulation top side, on the base substrate and around the base integrated circuit; forming a base conductive via, having a base via head, through the base encapsulation and attached to the base substrate adjacent to the base integrated circuit, the base via head exposed from and coplanar with the base encapsulation top side; mounting an interposer structure over the base encapsulation with the interposer structure connected to the base via head; and forming an upper encapsulation on the base encapsulation top side and partially surrounding the interposer structure with a side of the interposer structure facing away from the base encapsulation exposed. |
申请公布号 |
US8716065(B2) |
申请公布日期 |
2014.05.06 |
申请号 |
US201113243886 |
申请日期 |
2011.09.23 |
申请人 |
CHI HEEJO;CHO NAMJU;SHIN HANGIL;STATS CHIPPAC LTD. |
发明人 |
CHI HEEJO;CHO NAMJU;SHIN HANGIL |
分类号 |
H01L21/50;H01L21/48;H01L23/02;H01L23/16;H01L23/31 |
主分类号 |
H01L21/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|