发明名称 |
Scalable high-bandwidth connectivity |
摘要 |
A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly. |
申请公布号 |
US8714459(B2) |
申请公布日期 |
2014.05.06 |
申请号 |
US201213471052 |
申请日期 |
2012.05.14 |
申请人 |
MCCORMACK GARY D.;KYLES IAN A.;WAVECONNEX, INC. |
发明人 |
MCCORMACK GARY D.;KYLES IAN A. |
分类号 |
G06K19/06 |
主分类号 |
G06K19/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|