发明名称 |
Thermally efficient integrated circuit package |
摘要 |
In one aspect of the present invention, an integrated circuit package will be described. The integrated circuit package includes at least two integrated circuits that are attached with a substrate. The integrated circuits and the substrates are at least partially encapsulated in a molding material. There is a groove or air gap that extends partially through the molding material and that is arranged to form a thermal barrier between the integrated circuits. |
申请公布号 |
US8716830(B2) |
申请公布日期 |
2014.05.06 |
申请号 |
US201113304167 |
申请日期 |
2011.11.23 |
申请人 |
PODDAR ANINDYA;NGUYEN LUU T.;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
PODDAR ANINDYA;NGUYEN LUU T. |
分类号 |
H01L21/70 |
主分类号 |
H01L21/70 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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