发明名称 Adhesive composition for a debondable self-adhesive label
摘要 Hot-melt pressure-sensitive adhesive (HMPSA) composition is disclosed comprising: a) 25 to 50% of a blend of SBS and SB styrene block copolymers; b) 45 to 75% of compatible tackifying resins having a softening temperature of between 80 to 150° C.; and c) 0.5 to 5.5% of fatty acids, the hydrocarbon chain of which comprises 10 to 22 carbon atoms. Also disclosed are a multilayer system comprising an HMPSA layer, a printable support layer and an adjacent protective layer. A self-adhesive label and process for recycling a labeled article with debonding of said label by immersing the article in a hot basic aqueous solution are also disclosed.
申请公布号 US8715797(B2) 申请公布日期 2014.05.06
申请号 US20080525438 申请日期 2008.01.31
申请人 FOUQUAY STÉPHANE ANDRÉ;GOUBARD DAVID;BOSTIK S.A. 发明人 FOUQUAY STÉPHANE ANDRÉ;GOUBARD DAVID
分类号 B32B1/08;B29B17/00;C08K5/04;C08K5/09 主分类号 B32B1/08
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