发明名称 System-in-package platform for electronic-microfluidic devices
摘要 An integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate on a first support, an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. A micro fluidic structure is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support.
申请公布号 US8715592(B2) 申请公布日期 2014.05.06
申请号 US201313755293 申请日期 2013.01.31
申请人 DEKKER RONALD;PIJNENBURG REMCO HENRICUS WILHELMUS;VAN VEEN NICOLAAS JOHANNES ANTHONIUS;KONINKLIJKE PHILIPS N.V. 发明人 DEKKER RONALD;PIJNENBURG REMCO HENRICUS WILHELMUS;VAN VEEN NICOLAAS JOHANNES ANTHONIUS
分类号 G01N15/06 主分类号 G01N15/06
代理机构 代理人
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