| 摘要 |
In an apparatus for manufacturing an integrated circuit device comprising a first chamber which performs a unit process using a chemical; and a second chamber which is successively arranged with the first chamber to remove the chemical remaining on a substrate when the unit process using the first chamber is performed, the apparatus for manufacturing an integrated circuit device may comprise a first spraying part which is installed near the inlet of the second chamber and sprays a cleaning solution to the substrate to remove the chemical remaining on the substrate; and a second spraying part which is arranged in the back part of the first spraying part in the second chamber and sprays a cleaning solution on the substrate. |
