| 摘要 |
The present invention forms a film on a substrate for a product only with any loading region among a plurality of loading regions while suppressing an increase of cost and the generation of particles when forming the film by using a substrate treatment apparatus having a plurality of rotary tables, each of which is provided with the loading regions arranged along a circumferential direction of a treatment container to load substrates. When forming a film on a product wafer (W) only in a specific slot (20) among five slots (20), it is set that the product wafer (W) is transferred to the specific slot (20) in advance, and it is set that a dummy wafer (W) is transferred to another slot (20). And, when specifying a slot (20) for the transfer destination of the product wafer (W), it is specified whether any wafer (W) is to be transferred at a position where the wafer (W) is housed in a transfer container (5). |
