发明名称 DEVICE COMPRISING AN ENCAPSULATION UNIT
摘要 A device that includes a component and an encapsulation arrangement for the encapsulation of the component with respect to moisture and/or oxygen, wherein the encapsulation arrangement has a first layer and thereabove a second layer on at least one surface of the component, the first layer and the second layer each comprise an inorganic material, and the second layer is arranged directly on the first layer.
申请公布号 US2014117569(A1) 申请公布日期 2014.05.01
申请号 US201414150291 申请日期 2014.01.08
申请人 SCHMID CHRISTIAN;SCHLENKER TILMAN;ZULL HERIBERT;PAETZOLD RALPH;KLEIN MARKUS;HEUSER KARSTEN;OSRAM OPTO SEMICONDUCTORS GMBH 发明人 SCHMID CHRISTIAN;SCHLENKER TILMAN;ZULL HERIBERT;PAETZOLD RALPH;KLEIN MARKUS;HEUSER KARSTEN
分类号 H01L23/31 主分类号 H01L23/31
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